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[EDA Alert]

EDA Alert: August 19, 2008



John Arkontaky, David Maliniak  |   ED Online ID #19861  |   August 19, 2008

Article Rating: Not Rated

ED_EDA Alert Update_: Cadence Abandons Its Bid To Buy Mentor Graphics

EDA Alert e-Newsletter |   August 19, 2008

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top story |

Cadence Abandons Its Bid To Buy Mentor Graphics



There will be no merger of Cadence Design Systems and Mentor Graphics after all. Cadence has withdrawn its proposal to acquire all of the outstanding shares of Mentor Graphics’ common stock. Instead, Cadence’s board of directors has authorized a $500 million increase to Cadence’s stock repurchase program.

Read the full article...


engineer's resource |

New Product Showcase: Texas Instruments' Step-Down Converter


  Doug Phillips, Worldwide Marketing Manager for Power Management at Texas Instruments, discusses the ultra-thin, 6MHz, 500mA TPS62601 step-down converter. Watch it now...
(Note: Video might take a minute to download, click only once.)



NI Week
One of the best conferences I go to each year is NIWeek. Another has come and gone, but like always I got a glimpse at some solid technology from the mega-company. National Instruments has been sponsoring their own conference here in Austin, TX for several years now, and it has become a solid industry event. Why? Simply because NI's products like LabVIEW software, data acquisition hardware, and virtual instruments have become so widely used.

Your Ideas For Design Can Win $500
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Click here for our guidelines on Ideas for Design.

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engineering tv |

Fire Scout UAV: Part 1



Northrop Grumman's Transformational Fire Scout Vertical Takeoff and Landing Tactical Unmanned Aerial Vehicle system provides unprecedented situation awareness and precision targeting support for U.S. Armed Forces of the future. The MQ-8B Fire Scout has the ability to autonomously take off and land on any aviation-capable warship and at prepared and unprepared landing zones in proximity to the soldier in contact.


news |

Constraint-Driven Flow Targets PCB High-Density Interconnects



With pin pitches shrinking on FPGAs and other IC packages, many printed-circuit board (PCB) designers—like it or not—are forced to enter the realm of high-density interconnects (HDIs). In response to this trend, Cadence has announced the SPB 16.2 release of its Allegro and OrCAD families of PCB design flow. While the flow has offered constraint-driven design for some time, that capability is now coupled with new features aimed at HDIs.

Read the full article...

PCB Tools Cross-Probe Between Layout And Schematic



Providing a valuable mechanism for design, review, verification, and testing of printed-circuit board (PCB) designs, CircuitSpace Foundation from DesignAdvance Systems now offers cross-probing between layouts and PDF schematics. The new cross-probing capability adds to CircuitSpace’s existing auto-clustering and replication technologies and works seamlessly within Cadence’s Allegro PCB design environment.

Read the full article...

DDR3 and DDR2 Memory IP Bolsters SoC Designs



A full range of DesignWare DDR intellectual property (IP) is available for systems-on-a-chip (SoCs) that require an interface to high-performance DDR3, DDR2, and DDR memory subsystems. The DesignWare DDR IP delivers memory system performance of up to 1600 Mbps, which is the maximum data rate of the JEDEC DDR3 specification. The IP includes configurable protocol and memory controllers, integrated mixed-signal PHYs including I/Os, and verification IP.

Read the full article...

User Advisory Group To Guide Open Verification Methodology’s Evolution



The best cooperative efforts in the EDA industry are guided by the collective input of users and technology providers. Those that aren’t tend to be dominated by one or two key players, making them somewhat less than truly cooperative. The Open Verification Methodology (OVM) World community is striving for the former path through its establishment of the OVM Advisory Group (OAG), an organization of distinguished users and ecosystem suppliers.

Read the full article...

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Happenings/Conferences |

International Conference on Parallel and Distributed Computing Systems
Singapore
Aug. 29-31





Symposium on Integrated and Systems Design
Gramado, Brazil
Sep 1-4




Euromicro Conference on Digital System Design
Parma, Italy
Sep. 3-5




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ED bookstore |

BGA Breakouts & Routing


By Charles Pfeil, Mentor Graphics


Call it a “vanity” publishing project if you will, but Charles Pfeil’s book, BGA Breakouts & Routing, published by his employer, Mentor Graphics, is more than worth the price of admission. Pfeil, who is the engineering director of Mentor’s System Design Division, is an acknowledged industry expert in the black art of printed-circuit board (PCB) routing, and he brings his expertise to bear on this densely-packed and richly-illustrated volume.

Read the full article...




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