InGaAs Photodiode Arrays Back-Illuminated

Oct. 1, 2003
Available as a single element and as a 4- or 8-element array, the FCI-InGaAs-300B1XX backside-illuminated photodiode arrays are designed for flip-chip or traditional mounting to an optical plane for front or back illumination. The new sensors are said

Available as a single element and as a 4- or 8-element array, the FCI-InGaAs-300B1XX backside-illuminated photodiode arrays are designed for flip-chip or traditional mounting to an optical plane for front or back illumination. The new sensors are said to exhibit high responsivity when illuminated from the back or front. They also have a low noise spec and a spectral range of 900 to 1,700 nm. The active area of the arrays is 300 µm and the pitch is 500 µm. The new sensors are said to be ideal for use in WDM applications, as well as in power monitoring, single and/or multi-mode fiber optic receivers, fast Ethernet, SONET/SDH OC-3/STM-1, and other uses. For more details, contact Steve Cuffel at OSI FIBERCOMM, Hawthorne, CA. (310) 978-0516.

Company: OSI FIBERCOMM

Product URL: Click here for more information

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