Electronicdesign Com Products Analog And Mixed Signal Mosfet Packaging Results In Smaller Eight Pin Devi
Electronicdesign Com Products Analog And Mixed Signal Mosfet Packaging Results In Smaller Eight Pin Devi
Electronicdesign Com Products Analog And Mixed Signal Mosfet Packaging Results In Smaller Eight Pin Devi
Electronicdesign Com Products Analog And Mixed Signal Mosfet Packaging Results In Smaller Eight Pin Devi
Electronicdesign Com Products Analog And Mixed Signal Mosfet Packaging Results In Smaller Eight Pin Devi

MOSFET Packaging Results In Smaller Eight-Pin Devices

July 1, 2002
Reporting a 30% smaller footprint than six-pin VS-6 devices, the VS-8 eight-pin, surface-mount package for power MOSFETs measures just 0.85-mm thick. Currently available packages are said to measure 1.1-mm thick. The new package occupies an area of

Reporting a 30% smaller footprint than six-pin VS-6 devices, the VS-8 eight-pin, surface-mount package for power MOSFETs measures just 0.85-mm thick. Currently available packages are said to measure 1.1-mm thick. The new package occupies an area of 5.15 mm2 and measures 1.9 mm x 2.9 mm. In addition to tight dimensions, the VS-8 promises improved power dissipation in the order of 2.5W at t

Company: TOSHIBA AMERICA ELECTRONIC COMPONENTS INC.

Product URL: Click here for more information

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