Employing a unique package that enables up to 80% higher power dissipation and up to 50% more current in a standard footprint, the DualCool NexFET power MOSFETs are allegedly the first such devices to dissipate heat through the top of the package. The single-phase, 35A synchronous buck converter devices employ single MOSFETs for both the high and low side switches in high-current dc/dc applications. Their enhanced packaging technology reduces thermal impedance on the top of package from 10ºC to 15°C per Watt to 1.2°C per Watt. Available I an industry-standard SON package with a 5 mm x 6 mm footprint, pricing for the CSD16325Q5C is $1.47 each/1,000. TEXAS INSTRUMENTS INC., Dallas, TX. (800) 477-8924.