Darvin Edwards

Darvin Edwards, TI Fellow, manages the SC Packaging modeling team at Texas Instruments. His team is responsible for electrical, thermal, and thermomechanical analysis of new products and package developments. He received his BS in physics from Arizona State University and holds 20 patents. He also has authored or co-authored over 45 papers, articles, and book chapters and has lectured on thermal challenges, modeling, reliability, electrostatic discharge (ESD), and 3D packaging

Darvin’s Recent activity