Daryl Heussner is a senior member of the Technical Staff at Texas Instruments with over 18 years of experience in semiconductors and semiconductor packaging. He holds a BS in electrical engineering from Texas A&M University and has held roles supporting SI node process development, wire bond and flip packaging co-design, and package process development and roadmap. He was elected to the TI Technical Staff in 2000 for contributions in package design and later senior member in 2006 for contributions in the area of flip-chip BGA packaging. He leads a team at TI focusing on optimizing die and package co-design for manufacturing across TI package technologies.