Engineering Radio

Episode 4 – The Earthquake in Japan, Plus Coverage of APEC, Mobile World Congress and Embedded World

Episode 4: The Earthquake in Japan, Plus Coverage of APEC, Mobile World Congress and Embedded World
Original Launch Date: March 21, 2011

Hope you have enjoyed the first few programs of Engineering Radio! In today’s program we will be discussing some important issues:

   
Technology Editor Bill Wong will talk with Jim Handy of Objective Analysis about the effects of the earthquake on the semiconductor market and how robots might help in a situation like this.

  
Don Tuite, our analog and power technology editor, will be talking about the most interesting announcements and goings-on at APEC.


  
Paul Whytock, editor of Electronic Design Europe, tells about his experiences at Mobile World Congress and Embedded World.

Go to the Engineering Radio Player

Download the MP3

 

Hide comments

Comments

  • Allowed HTML tags: <em> <strong> <blockquote> <br> <p>

Plain text

  • No HTML tags allowed.
  • Web page addresses and e-mail addresses turn into links automatically.
  • Lines and paragraphs break automatically.
Publish