Described as a simplified approach to mobile-phone design, CameraCube technology emerges as a three-dimensional reflowable camera solution that combines a single-chip image sensor, embedded image processor, and wafer-level optics in one package. Reportedly, this approach enables the industry’s smallest profile and z-height, down to 2.5 mm x 2.9 mm x 2.5 mm. The initial two devices, the OVM6680 (400 x 400) and OVM7690 (VGA), can be directly soldered to a printed circuit board with no socket or insertion required, eliminating the need for additional components. Unlike traditional camera module designs that combine image sensors and lenses in a barrel, the CameraCube devices are assembled using wafer level alignment tools. The lens can be placed directly on CSP image sensors, which eliminates the need for flex cables and interposers. OMNIVISION TECHNOLOGIES INC., Sunnyvale, CA. (408) 542-3000.
Company: OMNIVISION TECHNOLOGIES INC.
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