Suited for server, mass storage and networking applications, Z-PACK HS3 is a two-piece, board-to-board backplane connector with a high-speed, high-density, modular design. The modular construction accommodates 25-mm signal modules and half-size end modules with guide pins and allows for a variety of pattern sizes.Ten- and six-row versions are available with 100 or 60 high-speed lines per 25 mm. The connector has a controlled impedance of 50 ohms and utilizes a dual microstrip configuration. It attaches to the daughterboard and motherboard by thru-hole press-fit pins. Three levels of sequencing are used. And the connector is compatible with standard and optional 2-mm HM models.