EE Product News

BGA Socket Is Side Stackable

Touting dramatic packaging density improvements, the Pin-Ball is said to be the industry's first side-stackable BGA socket. The socket can be soldered side-by-side with the LGA socket, providing 2 mm of clearance for other components. And it can be used for 1-mm and 1.27-mm pitch packages up to 50 mm on any board size. The spring is made of BeCu and exerts a force of 17g at a deflection of 0.025". Available in two- and four-bolt hold-down styles, the socket comes with either a metal cover or customized aluminum heatsink. Pricing starts at $1 per ball in quantities of five pieces. ARIES ELECTRONICS INC., Frenchtown, NJ. (908) 996-6841.

Company: ARIES ELECTRONICS INC.

Product URL: Click here for more information

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