EE Product News

BGA Test Socket Supports Mobile P-IIIs

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Designed to test the BGA version of the Mobile Pentium III processors, the 495-lead BallNest socket is surface-mounted directly on to the pc board's pads. The test socket features beryllium-copper contacts plated with 200 micro-inches of 90/10 tin/lead over nickel and terminated with 90/10 lead/tin solder balls on the bottom of the socket.
The socket's insulator, lid and base are constructed of UL94V-0-rated FR-4 material. Pricing for the test socket is $138.60 each in quantities under 25 pieces, with delivery times from three to five weeks ARO.

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