Offered with a pitch of 1 mm, this hybrid socket features a unique spring-type contact for use in both ball grid array (BGA) and chip-scale packaging (CSP) applications. The socket can also be provided with pitches down to 0.5 mm for CSP. The socket base contains the spring contacts and is bolted to the circuit board, with a socket cover used to mate the BGA device with the spring contacts. Pricing for prototype quantity ranges from $0.10 to $0.20 per contact. For more information, call Frank Folmsbee at ARIES ELECTRONICS INC., Frenchtown, NJ. (908) 996-6841.