EE Product News

Compact Package With Tiny Footprint Packs 1 Gb Of Memory

By using its patented LP-Stack technology, the company has developed a series of double data rate (DDR) SDRAM devices offering 256-Mb, 512-Mb and 1-Gb of memory in a package standing just 0.098" high and having a footprint equivalent in size to a 66-pin TSOP II package. The devices use a pc board-type material and stack together up to four memory chips arranged in x4, x8 and x16 data bit configurations. With LP-Stack DDR Series devices, SDRAM DIMMs can be built that offer up to 2 GB of memory.
The new stacked memory devices comply with JEDEC PC200/266 DDR SDRAM standards, come in various speed versions, and are targeted for use in applications ranging from servers to desktop PCs and workstations, as well as telecomm and networking equipment. Prices of a 512-Mb, 4-high stack begins at $60 each in quantity volumes.

Company: DENSE-PAC MICROSYSTEMS

Product URL: Click here for more information

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