EE Product News

CPU Board Withstands Harsh-Environments

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The CP604, a new low-power CompactPCI CPU, incorporates Intel’s mobile Pentium III at up to 700 MHz in a BGA package that draws 30% less power than the FCPGA equivalent. Suited for harsh-environment applications, the unit has direct-soldered SDRAM—up to 1 GB—and extended temperature operation from -40_C to +85_C at 400 MHz with passive cooling. Available in both System Master and Peripheral Master versions, the CP-604 supports Hot Swap and is equipped with IPMI (Intelligent Platform Management Interface). Also, the new CPU uses an onboard hard disk drive and a rear I/O PMC socket, which can provide an additional 1 GB SDRAM. Other features include a 4HP design, two Fast Ethernet ports, four serial channels (RS232/422/485) and a VGA-CRT socket on the front panel that can be replaced as needed by VGA-LVDS or COM2. The CP604 supports RackNET (for TCP/IP backplane transfers), Windows NT, Embedded NT, WIN2000, VxWorks and Linux. Pricing for a 400 MHz CP604 with 256 MB SDRAM starts at $2,373. PEP MODULAR COMPUTERS INC., Pittsburgh, PA. (412) 921-3322

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