Freescale Semiconductor and
Tundra Semiconductor have introduced an AMC development platform for manufacturers of high-capacity infrastructure equipment. The platform leverages Serial RapidIO interconnect technology, using Tundra's Tsi578 switch to cluster four Freescale MSC8144 multi-core DSPs in an AMC single-width form factor. The platform addresses interconnect bandwidth requirements of up to 10 Gbps between on-board components in applications such as wireless base stations, radio network controllers, media gateways, video conferencing and radar signal processing. FREESCALE SEMICONDUCTOR, Austin, TX. (800) 521-6274. TUNDRA SEMICONDUCTOR CORP., Ottawa, Ontario, Canada. (800) 267-7231. (See figure)
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1. Tsi578: A Serial RapidIO switch that supports 80 Gb/s aggregate bandwidth and can be configured as a 16-port x1 switch or an 8-port x4 switch (or various combinations of x1 and x4). Each of the ports can be run at 1.25 Gbaud, 2.5 Gbaud or 3.125 Gbaud. Features include support for the 1.3 RapidIO specification, hardware multicast, traffic management through scheduling algorithms, programmable buffer depth, and fabric performance monitoring to supervise and manage traffic flow.
2. MSC8144: This chip combines four StarCore DSP cores at up to 1 GHz each. The device integrates a large embedded memory, enabling higher throughput to memories than external DDR while reducing chip count and BOM. The part also leverages dual RISC QUICCEngine technology at 400 MHz to offload networking protocols, and it offers high speed interfaces such as the x4 Serial RapidIO and dual SGMII Gigabit Ethernet interfaces.
Company: TUNDRA SEMICONDUCTOR CORP.
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