Digital Interconnects Are Stackable

The HSLink 2 mm backplane interconnection system can transfer data at up to 100 MHz for applications such as high-density, high-fidelity cable links in telecomm, datacomm, and instrumentation. HSLink is compatible with standard backplane board mounted connectors and shrouds including the AMP Z-Pack FB, BERG METRAL, CANNON TEMPUS, and FCI MLLIPACS 1. Stackable at 100% density, the HSLink is available in five contact wafer modules and stackable blocks of up to 25 wafers. Wafers can be butt-mated to maintain full 2 mm grid density. The contacts are gold-plated phosphor-bronze with a dual wiping action for high reliability and repeated insertion and withdrawal.