EE Product News

Enclosures Keep Cool In High Availability Apps

Overheating problems are said to solved with the RME CoolSlot line of rack-mount enclosures, which use the firm's patented CoolSlot card guides to eliminate cooling "dead spots" on boards and provide more uniform airflow throughout the system. Testing is said to show an improvement of 50% in board areas near the front panel and backplane that are blocked by the extrusions and thus normally deprived of airflow. The enclosures are available with the company's CompactPCI or VME64x backplanes.
Power options include dual 230W hot-swappable power supplies mounted in front, a rear-mounted 230W ATX-style power supply, or the enclosure can be wired for up to three front-access cPCI style hot-swap power supplies. Several types of peripheral shuttles are also available. Pricing for the units begins at $3,100.

Company: HYBRICON CORP. - Sales Department

Product URL: Click here for more information

Hide comments

Comments

  • Allowed HTML tags: <em> <strong> <blockquote> <br> <p>

Plain text

  • No HTML tags allowed.
  • Web page addresses and e-mail addresses turn into links automatically.
  • Lines and paragraphs break automatically.
Publish