Offered as an improved means of electronics packaging and surface-mount attachment, the TechFilm line of film adhesives are said to be accurately pre-dispensed on easy-to-handle carrier sheets, continuous roles, or pre-forms to the OEM's specs.
Once the film adhesive is applied to one component or substrate, the carrier sheet is removed and another component can be easily mated to the circuit board. The adhesive is activated with heat and is said to produce excellent, uniform bonds. And with TechFilm film adhesives, there reportedly is no mess, no fumes, no dispenser orifices to unclog, and no reservoirs to clean.
Company: ADHESIVE PACKAGING SPECIALTIES INC. (APS)
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