EE Product News

FPGA Shrinks Into Compact BGA

Targeting portable applications such as smart phones, personal media players, and industrial hand-held instruments, the QL8150 Eclipse II FPGA sets up shop in an 8 mm x 8 mm, 196-ball BGA package measuring 0.5-mm thick. Offered in lead-free packaging only, the device operates over an industrial temperature range from -40°C to +100°C.Similar to other Eclipse devices, the FPGA comes with complete support on all levels including packaging, intellectual property, software drivers, reference designs, and development boards. Intellectual property, including IDE, PCI, and SDIO, is supported with drivers for WinCE and Linux. Additionally, a development board, the Mobile Application Board, is supported on the Intel PXA27x platform. Pricing for the QL8150-6PUN196C will be less than $5 each in volume by the end of 2006. For more details, call QUICKLOGIC CORP., Sunnyvale, CA. (408) 990-4000.

Company: QUICKLOGIC CORP.

Product URL: Click here for more information

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