The 804 and 805 series interconnects address high pin count I/O and board-to-board applications. A triple row pin field allows for denser signal connections while placing and soldering one connector rather than three SIP sockets or a single and double row combination increases assembly efficiency and improves positional accuracy. Triple row packages on a 2.54-mm grid are available with nine- to 96-position configurations in increments of three. MILL-MAX MANUFACTURING CORP., Oyster Bay, NY. (516) 922-6000.