The TPCM/TPCF series high-density power-to-board interconnect system is fabricated on a 2-mm pitch, allowing it be used for elevated board stacking. Containing four rows, the interconnects can handle up to 27A at 80°C over four banks of four power pins each. For board stacking applications, the board spacing with standard connectors can range from 10 mm to 20 mm. Other features include end shrouds for proper mating in blind applications, and tuning-fork style phosphor bronze contacts. Pricing begins $0.06 and $0.08 per mated line. SAMTEC INC., New Albany, IN. (800) 726-8329.
Company: SAMTEC INC.
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