Electronic Design

Interconnects

Differential Signal Connector Supports Gigabit Transfer Rates
The Micro Giga (MICRO GIGACN) series of high-density differential connectors supports data-transfer rates up to 5 Gbits/s. Available in a board-to-board, surface-mount plug and socket, these connectors have an 8-mm stacking height. They also have a 0.75-mm contact pitch, with a 0.5-mm pitch between leads. Sequential mating, meanwhile, provides hot pluggability and electrostatic-discharge protection. MICRO GIGACN models are self-aligning to enable blind mating as well.

Their modified strip-line structure controls impedance and noise by isolating each individual signal contact with a ground. Integral ground/power blades separate each signal pair. Each signal pair's centerline forms a virtual ground plane. As a result, these connectors have less than 0.2 dB of insertion loss at 2.5 Gbits/s (1.25 GHz), less than 3% crosstalk, and 100-Ω impedance matching at 100-ps rise time.

Models are available with 12, 24, and 36 contact pairs. A mated stacking connector pair with 24 signal pairs (48 signals, 25 ground blades) costs $12.97 in 10,000-unit quantities. Delivery is eight to 12 weeks ARO.

Fujitsu Takamisawa America Inc., 250 Carribean Dr., Sunnyvale, CA 94089; (800) 380-0059, (408) 745-4900; fax (408) 745-4971; www.fujitsu.takamisawa.com.



Test Socket For QFP Devices Features A 0.4-mm Lead Pitch
A high-frequency test socket with a 0.4-mm lead pitch has been designed for QFP and other device packages. According to its manufacturer, this is the smallest lead pitch available for testing high-frequency devices. It also can be furnished for any peripheral leaded package. The Microstrip Contacts used in this socket have life cycles that typically exceed 500,000 insertions/withdrawals with no loss of performance.

The contacts provide just 0.01-nH self-inductance per contact. Meanwhile, the socket exhibits a 10.0-GHz frequency response with only 1.0-dB signal loss. It can be used between −55°C and 170°C. It's available in both automatic and manual versions, with lead counts up to 208. Also, its contact block is UL 94V-0 thermoplastic. Its Microstrip Contacts are 0.008 in. wide and plated with a hard gold.

A 48-lead manual MQFP socket costs $1174 in five-piece batches. Delivery is six weeks ARO.

Aries Electronics Inc., P.O. Box 130, Frenchtown, NJ 08825; (908) 996-6841; www.arieselec.com.



GBIC Guide Rails Available In Solderable Plated Plastic
Models in a line of high-temperature plastic guide rails designed for gigabit interface converters (GBICs) come with a copper/nickel plating that's compatible with conventional soldering processes. These rails can be loaded onto circuit boards and soldered along with the rest of the components on the boards. According to their manufacturer, they deliver electromagnetic shielding typical of the best metal GBIC rails, but without the problems associated with metal rails. They also weigh less than metal rails, which can be significant in systems that use multiple GBIC rails on one circuit board.

Available from stock, rails cost $2.50 each in high-production volumes.

dataMate Products, Methode Electronics Inc., Sales Dept., 7447 W. Wilson Ave., Chicago, IL 60706; (708) 867-9600; fax (708) 867-3149; www.methode.com.



BGA Production Socket Boasts Lead Inductance Under 2 nH
According to its manufacturer, a recent line of BGA prototyping and production sockets provides designers with an easier and more reliable method for installing BGA packages in prototype and production systems. These screw-lock BGA sockets also guarantee contact even under the highest shock and vibration. The Zero Insertion Force (ZIF) version provides quick chip insertion and removal, while the "raised SMD" version raises the socket's height for clearance over adjacent components.

These sockets enable multiple chip testing of up to 5000 insertions. They have less than 2-nH lead inductance for optimum signal integrity and at-speed operation. Also, they eliminate the need to design-in additional signal access pins/points. They prevent time-consuming board revisions. And, they have a 6-mm horizontal clearance and a vertical clearance of less than 10 mm.

Prices start at $125 for batches of one to five pieces. Over 75 models are available, with a stock to six-week lead time depending on size and quantity.

Emulation Technology, 2344 Walsh Ave., Bldg. F, Santa Clara, CA 95051; (800) ADAPTER, (408) 982-0660; fax (408) 982-0664; www.1800ADAPTER.com.



USB Plugs Feature Solder Tails And Gold-Plated Contacts
Snap-in solder tails that hold the connector in position during wave soldering can be found on a recent line of USB sockets. These solder tails are tin lead-plated for solderability. Gold-plated contacts provide low contact resistance and high reliability. The sockets themselves permit port expansion by alleviating the restriction of limited COM ports and available IRQs. Up to 127 devices can be daisy chained to the root hub. Also, the 12-Mbit/s data transfer is three to five times faster than parallel devices and 20 to 40 times faster than serial ports.

With these sockets, designers can hot swap peripherals. As true plug-and-play devices for simple connections, they require no jumper, DIP switches, or IRQs to set. They also let USB speakers bypass the sound card and receive true digital audio sound quality. Users can choose from horizontal or vertical single A or dual A (stacked) types, along with the horizontal B type. Sockets feature a phosphor bronze shell and contacts, thermoplastic UL-rated 94V-0 insulator, and gold flash over the nickel contact area.

Contact the company for pricing and availability information.

Keystone Electronics Corp., 31-07 20th Rd., Astoria, NY 11105-2017; (800) 221-5510, (718) 956-8900; fax (718) 956-9040; www.keyelco.com.



0.5-mm Burn-In Test Socket Targets Wireless-Device Market
Designers of memory and logic ICs that use the ultrafine 0.5-mm-pitch chip-scale package can take advantage of a socket family that acts as a high-volume burn-in test solution. The series supports wireless devices that rely on fine-pitch semiconductors to achieve high performance in small packages. It features a clamshell design for easy insertion. During testing, sockets are held onto the burn-in board with screws that compress the contact elements and provide a semipermanent interconnect.

Each socket boasts a 10- to 12-g target force, with a 15-g maximum. Additionally, family members operate from −55°C to 150°C, with a 127°C expected burn-in temperature. The line also has an I/O range of 40, 56, 84, 151, 241, and 289, or higher and lower for custom configurations.

Contact the company for pricing information.

Texas Instruments, Jane Bumpus, (508) 236-5283; www.ti.com.

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