Interconnects Enable High Density Board Stacking

Nov. 1, 2001

SamArray interconnects are said to provide high density, high speed and high reliability with standard board-to-board interconnects. The 4.15 mm profile system is designed for the OC-192 transponder MSA. The YFS, YFT and YFW series .050" pitch interfaces are available with up to 500 I/Os. At 100 ps rise time, the maximum differential impedance mismatch is 3%, and the maximum near end cross talk is .05% -3.5%. The system performs up to 10 GHz. The YFS socket features the four-finger Tiger Eye contact. Standard board-to-board spaces are 4.15 mm, 5 mm, 7 mm, 9 mm and 12 mm, with 19 mm and 25 mm systems in design. The interfaces are surface mounted and processed with standard BGA processing techniques. Pricing for the SamArray interfaces begins at $0.10 cents per mated line. SAMTEC, INC., New Albany, IN. (800) 726-8329.

Sponsored Recommendations

Highly Integrated 20A Digital Power Module for High Current Applications

March 20, 2024
Renesas latest power module delivers the highest efficiency (up to 94% peak) and fast time-to-market solution in an extremely small footprint. The RRM12120 is ideal for space...

Empowering Innovation: Your Power Partner for Tomorrow's Challenges

March 20, 2024
Discover how innovation, quality, and reliability are embedded into every aspect of Renesas' power products.

Article: Meeting the challenges of power conversion in e-bikes

March 18, 2024
Managing electrical noise in a compact and lightweight vehicle is a perpetual obstacle

Power modules provide high-efficiency conversion between 400V and 800V systems for electric vehicles

March 18, 2024
Porsche, Hyundai and GMC all are converting 400 – 800V today in very different ways. Learn more about how power modules stack up to these discrete designs.

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!