EE Product News

Interconnects Provide High-Density Board Stacking

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Said to provide high density, high speed and high reliability with standard board-to-board interconnects, the SamArray interconnect system is designed for the OC-192 transponder MSA (Multiple Source Agreement). These 0.50" pitch interfaces, named the YFS, YFT, and YFW Series, are available with up to 500 I/Os. At 100 ps rise time, the maximum differential impedance mismatch is 3%, and the maximum near-end crosstalk is 0.05%. The YFS socket features the company's four-finger Tiger Eye contact. Standard board-to-board spaces are 4.15 mm, 5 mm, 7 mm, 9 mm and 12 mm. Pricing begins at $0.10 to $0.12 per mated line. SAMTEC INC., New Albany, IN. (800) 726-8329.

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