The packaging of electronic devices is an evolving art driven by the requirements of smaller, lighter, portable, battery-powered products, such as cell phones, PDAs, notebook computers, CD-ROM players, and so forth. With space at a premium to accommodate the myriad of electronic devices, component manufacturers are developing miniature packages that occupy minimal area while maximizing the integration of functions.
A second trend involves reducing the power demands of portable electronics, enabling longer operational time while running off battery power. The result is lower-consumption power devices in smaller packages, coupled with an ability to transfer the heat generated internally away from the package to improve performance and reliability. A third trend—long underway—is the replacement of through-hole packaging with surface-mount packaging. This allows for smaller devices, as well as reduces pc-board area and optimizes the board-trace routing.