Modular Mezzanine Connectors Surpass 28-Gbit/s Signal Integrity

Lisle, Ill., U.S.: The Molex NeoScale modular mezzanine interconnect system is designed to offer optimal signal integrity at more than 28 Gbits/s. Intended for printed-circuit board (PCB) mezzanines in enterprise networking towers and telecoms hubs and servers, its patent-pending triad wafer configuration isolates each differential pair for optimal performance and customisation (see the figure).


The Molex NeoScale modular mezzanine interconnect system’s patent-pending triad wafer configuration isolates each differential pair for optimal performance and customisation.

The NeoScale triad has three pins per differential pair, two signal pins, and one shielded ground pin. Each triad is a standalone 28-Gbit/s differential pair. The interconnect housing’s honeycomb construction routes each triad to minimise crosstalk and effectively route out of the PCB in one or two layers. Tombstone structures located in the connector housing protect the mating interface and flexible contacts to help prevent damage to the terminals.

Featuring a density of 82 differential pairs per square inch, the NeoScale layout can be customised with high-speed differential pairs, high-speed single-ended traces, low-speed single-ended lines, and power contacts. Available with 85- and 100-Ω impedance and a mated stack height range of 12 to 40 mm, NeoScale design options include six to 30 circuit column sizes with two-, four-, six-, and eight- row options available, ranging from 12 to 240 triads in one assembly.

Molex

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