EE Product News

Modules Meld I/O And DSP To Tackle Communications Apps

product pic

Tailored specifically for the company's CHAMP VME and cPCI digital signal processing boards, these new off-the-shelf, PMC-based interconnect cards and modules are said to provide highly flexible connections to real-world I/O. They also integrate both hardware and software solutions for a wide range of applications including wireless digital radio and software receivers, semiconductor fabrication and test equipment, sonar and imaging, telecomm and networking, and high-speed serial interconnect fabrics.

Hide comments

Comments

  • Allowed HTML tags: <em> <strong> <blockquote> <br> <p>

Plain text

  • No HTML tags allowed.
  • Web page addresses and e-mail addresses turn into links automatically.
  • Lines and paragraphs break automatically.
Publish