New Packaging Reduces FPGA Footprints Used In Portables

Sept. 1, 2001

These chip-scale packages for the eX family of field-programmable gate arrays (FPGAs) boast of the smallest footprint in the industry for devices of comparable density. First introduced in September 2000, the eX family consists of three devices: the eX64, eX128 and eX256 with system gate densities of 3,000, 6,000 and 12,000, respectively. A range of chip-scale packages are being offered, including 49-, 128- and 180-ball packages. The eX family of devices, already optimized for portable applications, will have its space requirements on pc boards further reduced with the new packages. The eX family is currently being designed into cable and xDSL modems, digital photography products, MP3 Internet recorders/players, PDAs, and digital set-top boxes. The eX64, the 3,000-gate device, is available now in a 49-ball chip-scale package for $3.00/piece in quantities of 10,000. ACTEL CORP., Sunnyvale, CA. (888) 992-2835.

Sponsored Recommendations

Highly Integrated 20A Digital Power Module for High Current Applications

March 20, 2024
Renesas latest power module delivers the highest efficiency (up to 94% peak) and fast time-to-market solution in an extremely small footprint. The RRM12120 is ideal for space...

Empowering Innovation: Your Power Partner for Tomorrow's Challenges

March 20, 2024
Discover how innovation, quality, and reliability are embedded into every aspect of Renesas' power products.

Article: Meeting the challenges of power conversion in e-bikes

March 18, 2024
Managing electrical noise in a compact and lightweight vehicle is a perpetual obstacle

Power modules provide high-efficiency conversion between 400V and 800V systems for electric vehicles

March 18, 2024
Porsche, Hyundai and GMC all are converting 400 – 800V today in very different ways. Learn more about how power modules stack up to these discrete designs.

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!