Real estate requirements for power management circuits for mobile communication and computing products such as cell phones and notebooks can be dramatically reduced by using what are claimed to be the industry’s first power MOSFETs in a leadless package. Housed in an 8-pin, 1206-size SMT package, ChipFET power MOSFETs occupy roughly half the board area of TSOP-6 FETs, and also offer several performance improvements, including a 35% lower on-resistance and as much as a 25% increase in power dissipation. The 1206 package is available with single or dual power MOSFETs, with the duals including a combined n- and p-channel design. And the ChipFETs come in 8V, 20V and 30V versions with operating voltages as low as 1.8V.
Company: VISHAY SILICONIX
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