EE Product News

Northbrook, IL

Northbrook, IL-Troublesome CAD-to-CAM data transfer problems are one step closer to being eliminated, it's claimed, as the Institute for Interconnecting and Packaging Electronic Circuits (IPC) prepares to release its GenCAM series of standards. The IPC-2510, the series of standard identifying the new GenCAM format, is intended to capture the manufacturing information needed to: fabricate and test pc boards; assemble electronic components to the boards; inspect and electronically test the in-circuit requirements; and functionally operate the assembly. Plans call for providing the GenCAM rules, including syntext and semantic methodology, in electronic form for downloading by software developers.

Company: INSTITUTE FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS (IPC)

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