In full compliance with IEEE 1101.10 and 1101.11 requirements, the Cool-P series of enclosures solves overheating problems by employing the company's patented air-deflecting card guides. The unique guides are said to eliminate cooling dead spots on circuit boards while providing uniform airflow throughout the system. Resembling a standard pizza box in size, the enclosures measure 3.12" x 13.18" x 17", include three slots for 6U x 160 mm cards, and are available with either CompactPCI (cPCI) or VME backplanes installed. The cPCI backplane complies with the latest R3.0 PICMG cPCI specification and is available with the system slot on either the right or left side. A 120W power supply also included in each unit delivers outputs of 3.3V, 5V and 12V. Additional features include: provisions for 80-mm rear lug-in modules; front and rear ground clips; a rear ac-power switch; an ac power cord; and durable rubber feet. Prices start at $1,188 with delivery times from 4-6 weeks ARO.
Company: HYBRICON CORP.
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