EE Product News

Power Device Plus New Packaging Cut Component Count

Using the company's patented Powermite 3 surface mount packaging technology, a new device, called a MOSKEY, combines a MOSFET and Schottky diode in a single package. The new device is claimed to both reduce component counts and increase battery life for next generation multimedia mobile phones. The MOSFET is a 20 V, P-channel device containing a static cathode on source voltage of 400 mV. The Schottky diode portion is an ultra low forward voltage drop, 1 A, 20 V device said to be currently used in mobile phone applications. Designated as the UPFS320P, the device can be used in a step-up or step-down converter from single or multiple cell Li-Ion or Ni-based battery supplies, battery charge control circuits, and other power circuits where the MOSFET on resistance (RDSon), VF, board space, and power dissipation are of a critical nature.

Company: MICROSEMI CORP.

Product URL: Click here for more information

Hide comments

Comments

  • Allowed HTML tags: <em> <strong> <blockquote> <br> <p>

Plain text

  • No HTML tags allowed.
  • Web page addresses and e-mail addresses turn into links automatically.
  • Lines and paragraphs break automatically.
Publish