Processor module leverages dual-core Xeon processor

A high-performance Advanced Mezzanine Card (AdvancedMC) double-width, full-height processor module has its sights set on AdvancedTCA, MicroTCA, and proprietary platforms. Developed by Concurrent Technologies, the AM 100/20x uses the Dual-Core Intel Xeon processor to deliver high-performance processing. Also integrated is the Intel 3100 chip set, which combines server-class memory and I/O controller functions into a single component.

Among the applications earmarked for the AM 100/20x are wireless base stations, Voice over IP, media servers, blade servers within the communication market, as well as projects within the defence, security, and industrial markets. Accordingly, the AM 100/20x supports a number of industry-standard operating systems.

Regarding the new module, Glen Fawcett, CEO of Concurrent Technologies, says that “This new high-performance AMC processor board provides a marked improvement in performance/watt compared to a single-core Intel Xeon processor. By using processors and chip sets from Intel’s embedded roadmap, we can ensure that the product will be available for at least five years after release—a very important requirement for the majority of our customer base, whether they are in the defence or telco market sectors.”

The AM 100/20x module supports the Dual-Core Intel Xeon Processor LV at 2.0GHz or the Dual-Core Intel Xeon Processor ULV at 1.66GHz. By using appropriate operating systems and applications software, a computing throughput boost of up to two times a single-core Intel Xeon processor is possible for the same clock frequency. The Thermal Design Power (TDP) for the Dual-Core Intel Xeon Processor LV at 2.0GHz (667MHz FSB, 2MB shared L2 cache) is 31W versus 35W TDP for the single-core LV Intel Xeon processor at 2.0GHz (400MHz FSB, 512KB L2 cache).

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