Designed for use with QFP, LCC and SO devices, this RF test socket provides a built-in, spring-loaded heatsink to prevent deformation of device leads during testing cycles. The socket's heatsink is constructed from copper or aluminum, with gold or silver plating. The spring-loading feature provides compliancy, ensuring that it maintains constant contact with the device's heat pad.
The socket assembly is pressure-mounted to the load board. The heatsink can be coupled with pogo pins for better electrical contact, or with a thermocouple for direct thermal monitoring of the test package. Price is $3801 each for sockets having 48 leads or less.
Company: ARIES ELECTRONICS INC.
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