EE Product News

Silicone Adhesive Likes It Hot

With low thermal resistance and high bond strength, the 5405 thermally-conductive silicone adhesive is said to be suitable for bonding high-heat generating power devices to heat sinks. It is a single-component, zinc-oxide filled, heat-curable silicone that cures to a flexible, electrically isolating material. Capable of producing a very thin bond line, this adhesive can be used to bond the die to the lid in applications requiring compliant materials that do not induce stress. Capable of bonding metallic heat sinks, ceramic chips, and circuit board substrates, the adhesive cures in 10 minutes when exposed to 150°C heat.

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