EE Product News

Single-Package DAA Chip Integrates Isolation Barrier

The LiteLink chip is claimed as the industry's first complete data-access arrangement (DAA) device in a single 32-pin SOIC. By integrating the isolation barrier into the IC package, the chip reportedly reduces board real estate requirements by 50% or more compared with earlier DAA implementations. The chip meets all international standards, including V.90 and CTR21, which can speed end products to market by simplifying approvals.Designed for use in a variety of communication applications, including 56k modems and computer telephony, the LiteLink IC is compatible with all major modem chipsets. Samples are available now.

Hide comments

Comments

  • Allowed HTML tags: <em> <strong> <blockquote> <br> <p>

Plain text

  • No HTML tags allowed.
  • Web page addresses and e-mail addresses turn into links automatically.
  • Lines and paragraphs break automatically.
Publish