Electronic Design

Small Form-Factor Qseven Platform Gains Support

Two embedded computer module vendors, MSC Vertriebs GmbH and Hectronic, have joined the Qseven consortium, throwing their support to the new small form factor. Targeting next-generation embedded processors built using 45-nm technology, the Qseven platform will offer high-performance computing power on a board measuring 70 by 70 mm. The consortium plans to release a general specification and a design guide by the end of Q2 2008.

The specification will permit various processor configurations and allow a maximum dissipation of about 12 W. Typical applications will include automation/DIN rail systems, automotive, and any other application where an ultra-mobile embedded computing system is needed. For applications where heat is a concern, the spec defines a thermal cooling interface to help transfer any heat generated to a cooling solution.

Compared to other small form-factor approaches, Qseven features an onboard graphics controller with output options for 2x 24-bit LVDS, SDVO, DisplayPort, and HDMI. It also supports the new VESA DisplayID standard to automatically detect the attached flat-panel display. By leveraging the Mobile PCI Express Module (MXM) connect format, Qseven offers two connector heights, 5.5 mm and 7.8 mm.

MSC Vertriebs GmbH
www.msc-ge.com

Hectronic
www.hectronic.se

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