EE Product News

SMT Heatsinks Cool Hot Power Devices

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The Series 217 surface-mount heatsinks are designed for D2PAK, TO-220, SOT-223 and SOL-20 power devices. They're said to allow greater packaging densities and a reduction in pc-board area. Thermal performance is 0.13°C/W for the copper sinks with tin/lead plating. They're mounted astride components and reflowed to boards using standard equipment and processes.

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