Described as a simple solution to several electronic assembly problems, the PA-SOD3SM18-08 surface-mount to through-hole adapter allows an SOIC device to fit in a DIP footprint, thereby extending the operational life of existing printed-circuit boards. Reportedly, the component is particularly useful during production when obsolete DIP parts cause redesign and re-certification. Users can employ several adapters to populate an existing board and fill the gap while the redesign and re-certification process occurs. In prototyping, the adapter allows bread boarding of an SOIC device with a DIP footprint and socket, thereby making parts easier to probe and remove. The PA-SOD3SM18-08 accepts eight-pin SOICs with body widths of 150 and 210 mil. Single-unit price is $4 and quantity pricing is $2 each/1,000. LOGICAL SYSTEMS CORP., Syracuse NY. (315) 478-0722.
Company: LOGICAL SYSTEMS CORP.
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