EE Product News

Socket Packs 5000+ I/O On 1-mm Grid

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Said to solve the problem of connecting high I/O microprocessors or ASICs to pc boards, the Metallized Particle Interconnect (MPI) system is able to squeeze over 5000 I/O contacts onto a 1-mm grid pattern.The proprietary MPI material is formed into tiny microcolumns on a 1-mm grid and held in place by a thin polyamide substrate. The microcolumns align with pads on a land-grid array package and the pads on the printed circuit board. When mechanically compressed by the heatsink, the embedded metallized particles within the microcolumns join to form a conductive path between the printed circuit board and the land-grid array.

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