EE Product News

Sockets Interconnect BGAs, LGAs To PCBs

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Combining gold-plated beryllium-copper Fuzz Buttons with miniature gold-plated Hard Hat contact pins, these high-performance test sockets interconnect BGA and LGA devices to boards. Custom designed, sockets can meet lead spacing of 0.75 mm. For R&D hand test and production test uses, accessories are hand-held test clamps that let the same socket be used for either hand or production test. Fuzz Button sockets offer solderless board mounting, reduced signal path length, and overall improved electrical performance compared with conventional interconnect methods. Performance enhancements include reduced signal distortion, low inductance, multiple insertions, improved reliability and testing yields.

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