R253 solder paste is specifically formulated as a robust no-clean product with excellent print characteristics and can be processed in air or nitrogen environments while leaving minimal residue. And reflow characteristics are said to be excellent. The R253 flux residues are probe friendly and compatible with in-circuit testing equipment. R598 is an organic, water-soluble paste designed specifically to maintain its tackiness and printing characteristics for up to 10 hours while delivering exceptional solderability to a wide variety of metallic substrates. The activator package in R598 is extremely aggressive to provide superior welding to OSP coated boards and silver-palladium leaded components.
Company: KESTER SOLDER
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