A new solderable center probe socket enables users to debug a wide range of package types, including BGA, UBGA, MLF, and QFN, on the same package footprint. This surface mount adapter securely connects to standard center probe test sockets, claiming to provide a quick and highly reliable package test on populated pc boards. With a clearance of 1.52 mm for 0.80 mm and higher package pitch, the socket pressure mounts to the adapter, which is soldered to the pre-existing PCB footprint via standard reflow process. Insertion loss is 1 dB up to 5 GHz. Socket cycle life is greater than 100,000 insertions and withdrawals. Useable for virtually all packages up to 13 mm2, the socket is particularly suited for SRAM and DRAM packages. Pricing starts at $194 each/100. Delivery is six weeks ARO. ARIES ELECTRONICS INC., Frenchtown, NJ. (908) 996-6841.
Company: ARIES ELECTRONICS INC.
Product URL: Click here for more information