EE Product News

Thermal Analysis Software Adds Design Capabilities

Design capabilities, as well as ease-of-use and speed-to-solution features have been added to version 3.0 of Icepak CFD-based thermal analysis software. The new version adds these design capabilities to its modeling and simulation capabilities. The software allows an engineer to build a computer model of a product or system, then virtually prototype and testing it under real-world conditions. The program's object-oriented user interface supports easy access to the latest CFD technology. It is used for design of electronics thermal management systems in the computer, telecommunications, consumer electronics, and automotive industries. It predicts cooling at the component, board and cabinet levels, allowing designers to optimized designs without more costly physical prototyping.

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