EE Product News

Thermal Interface Material Fills Air Gaps

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The highly compressible nature of the Polarchip thermal interface material leaves it well-suited for filling the undesirable air gaps between heat generating devices on the pc boards and heatsinks, heat spreaders, and metal chassis that are used to dissipate the heat. It provides what's claimed as a dramatic improvement over existing thermal gap pads due to its level of compressibility and ease of handling.
The material is a fluoropolymer composite that consists of an expanded polytetrafluorethylene matrix filled with boron nitride particles. The material is suited for gap-filling applications.

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