With a 5 minute setup time at room temperature cure, Tra-Bond 2156 solvent-free, thixotropic paste is suitable for attaching heatsinks, passives, and bare or packaged ICs to pc boards. This two-part, easy-to-use system develops strong, durable high impact bonds within two hours at room temperature. The thermally conductive bonds improve heat transfer while maintaining electrical insulation. Epoxy bonds to metals, silica, alumina, ceramics, glass, plastics and many other substrates.
Company: TRA-CON INC.
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