Thin-Core Flip-Chip Package Offers Tight Via-To-Via Core Pitch

The CoreEZ semiconductor package developed by Endicott Interconnect Technologies uses an organic, thin-core build-up flip-chip (FC) technology that combines exceptional electrical performance, wireability, and reliability with a cost-sensitive material set. Reliability is twice the board-level reliability of a standard FC plastic ball-grid array (PBGA) or FC ceramic BGA. The technology permits full signal wiring on both sides of the core.

CoreEZ provides an excellent cost/performance ratio for users looking to make the jump from ceramic semiconductor packages to flip-chip technology. It employs particle-filled standard epoxy technology without the glass and is extremely thin, with the ability to replace standard build-up packages. The core via density provides 199-µm via-to-via core pitch, resulting in an essentially coreless structure. High core via density is achieved using smaller pads and 50-µm laser-drilled holes to unblock wiring channels through the core. This enables CoreEZ to provide up to twice the number of signal layers as a standard build-up package that uses mechanically drilled core vias with large capture pads.

The end result is an extremely cost-effective solution that allows full strip-line signal layers on both sides of the core. Component cost is further reduced by enabling die shrink through die pad pitch reduction down to 150 µm. In addition, the thinness of the core provides improved power distribution and the ability to dissipate chip thermal power into the pc board. CoreEZ is an excellent choice for applications requiring low-cost build-up materials along with high reliability, performance, and wireability, such as IP networking solutions. It is also well-suited to aerospace applications requiring radiation tolerance. CoreEZ parts are available in any shape, combining the dense circuitry found in chip packaging with the configuration variety found in traditional pc-board technology.