Taking advantage of an extremely small profile of 5.3 x 10.2 x 6.7 mm, the G6K electromechanical relay is designed for use on high-density pc boards in signal-level applications. The relay incorporates the firm's multi-bend lead frame design that starts at the top of the relay, increasing lead compliance and reducing stress on solder joints by a reported 75%. It can handle 1A at 30 vdc and 0.3A at 125 vac and comes in through-hole and SMT gull-wing and inside-L styles.
Company: OMRON ELECTRONICS INC.
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