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    Ultra-Mini SMT Relay Can Take The Heat

    April 1, 2001
    The 9800 series of ultra-miniature SMT reed relays utilize a higher temperature solder and solder paste for internal connections. The solder alloy, Sn95/Sb5, allows for a maximum board reflow temperature of 226°C for one minute as measured at the

    1 of Enlarge image

    The 9800 series of ultra-miniature SMT reed relays utilize a higher temperature solder and solder paste for internal connections. The solder alloy, Sn95/Sb5, allows for a maximum board reflow temperature of 226°C for one minute as measured at the component leads.
    The component combines small size with top RF performance, making it suitable for use in communications systems and instrumentation and fast rise time pulse switching up to 6 GHz.

    Company: COTO TECHNOLOGY

    Product URL: Click here for more information

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