Wakefield, MA

Wakefield, MA-The PCI Industrial Computer Manufacturers Group (PICMG) has approved and released Revision 1.0 of the CompactPCI Hot Swap Specification. Denoted PICMG 2.1, the document details how to implement the "hot swapping" of components in CompactPCI systems. The new specification defines pin sequencing and other enabling hardware technologies, as well as the software architecture required to support live insertion and extraction of boards in a running CompactPCI system. It also provides a framework for designing CompactPCI Hot Swap components, such as boards, backplanes, ICs, and platforms.